CPU comparison with benchmarks |
||
 |
-VS- |  |
CPU lineage |
||
|
Intel Xeon D-2779 or Intel Xeon D-2779 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-2779 features 16 processor cores and has the capability to manage 32 threads concurrently. It was released in Q1/2022 and belongs to the 4 generation of the Intel Xeon D series. To use the Intel Xeon D-2779, you'll need a motherboard with a BGA 2579 socket. |
||
| Intel Xeon D | Family | |
| Desktop / Server | Segment | -- |
| Intel Xeon D-2779 | Name | HiSilicon Kirin 910 |
| Intel Xeon D-2700 | Group | |
| 4 | Generation | -- |
CPU Cores and Base Frequency |
||
|
The Intel Xeon D-2779 has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the Intel Xeon D-2779 is 2.5 GHz and turbo frequency for one core is 3.4 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. |
||
| 16x Sunny Cove | Cores | None |
| 2.5 GHz | Frequency | None |
| 16 | CPU Cores | -- |
| normal | Core architecture | -- |
| Yes | Hyperthreading | No |
| No | Overclocking | No |
| 32 | Threads | -- |
| 3.4 GHz | Turbo Frequency (1 core) | None |
Internal Graphics |
||
|
The Intel Xeon D-2779 does not have integrated graphics.
The HiSilicon Kirin 910 does not have integrated graphics. |
||
| -- | GPU (Turbo) | -- |
| -- | Release date | -- |
| -- | Execution units | -- |
| -- | Direct X | -- |
| -- | Max. displays | -- |
| -- | Shaders | -- |
| GPU name | ||
| -- | GPU frequency | -- |
| 0 bytes | Max. GPU Memory | 0 bytes |
| -- | Generation | -- |
| -- | Technology | -- |
Artificial Intelligence and Machine Learning |
||
| -- | AI specifications | -- |
| -- | AI hardware | -- |
Hardware codec support |
||
|
A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
|
||
| -- | VP8 | -- |
| -- | VP9 | -- |
| -- | AVC | -- |
| -- | h264 | -- |
| -- | JPEG | -- |
| -- | VC-1 | -- |
| -- | AV1 | -- |
| -- | h265 / HEVC (8 bit) | -- |
| -- | h265 / HEVC (10 bit) | -- |
Memory & PCIe |
||
|
The processor supports a maximum memory capacity of 1.0 TB distributed across 4 memory channels. It offers a peak memory bandwidth of 102.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
|
||
| Yes | AES-NI | No |
| 1.0 TB | Max. Memory | 0 bytes |
| 102.4 GB/s | Bandwidth | -- |
| DDR4-3200 | Memory type | |
| pci | PCIe | pci |
| 4 | Memory channels | -- |
| Yes | ECC | No |
Thermal Management |
||
|
The processor has a thermal design power (TDP) of 126 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself. |
||
| 126 W | TDP (PL1 / PBP) | None |
| -- | Tjunction max | -- |
Technical details |
||
|
The Intel Xeon D-2779 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. |
||
| Technical data sheet | Documents | Technical data sheet |
| Q1/2022 | Release date | -- |
| BGA 2579 | Socket | |
| 25.0 MB | L2-Cache | 0 bytes |
| 0 bytes | L3-Cache | 0 bytes |
| Windows 10, Linux | Operating systems | |
| x86-64 (64 bit) | Instruction set (ISA) | |
| -- | Part Number | -- |
| Ice Lake | Architecture | -- |
| VT-x, VT-x EPT, VT-d | Virtualization | |
| 1558 $ | Release price | -- |
| SSE4.1, SSE4.2, AVX2, AVX-512 | ISA extensions | |
| Monolithic | Chip design | -- |
| 10 nm | Technology | -- |
iGPU - FP32 Performance (Single-precision GFLOPS)
|
|
HiSilicon Kirin 910
NoneC NoneT @ --
|
32
|
