Intel Xeon D-2779 vs HiSilicon Kirin 910

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon D-2779 or Intel Xeon D-2779 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-2779 features 16 processor cores and has the capability to manage 32 threads concurrently.
It was released in Q1/2022 and belongs to the 4 generation of the Intel Xeon D series.
To use the Intel Xeon D-2779, you'll need a motherboard with a BGA 2579 socket.
4 Generation --
Intel Xeon D Family
Intel Xeon D-2700 Group
Intel Xeon D-2779 Name HiSilicon Kirin 910
Desktop / Server Segment --
 
 

CPU Cores and Base Frequency

The Intel Xeon D-2779 has 16 CPU cores and can calculate 32 threads in parallel.
The clock frequency of the Intel Xeon D-2779 is 2.5 GHz
and turbo frequency for one core is 3.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
16 CPU Cores --
32 Threads --
3.4 GHz Turbo Frequency (1 core) None
2.5 GHz Frequency None
16x Sunny Cove Cores None
normal Core architecture --
No Overclocking No
Yes Hyperthreading No
 
 

Internal Graphics

The Intel Xeon D-2779 does not have integrated graphics.
The HiSilicon Kirin 910 does not have integrated graphics.
-- Generation --
-- Release date --
-- Max. displays --
-- Execution units --
-- Shaders --
-- GPU (Turbo) --
-- GPU frequency --
-- Technology --
GPU name
0 bytes Max. GPU Memory 0 bytes
-- Direct X --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- JPEG --
-- h264 --
-- AV1 --
-- VP9 --
-- h265 / HEVC (10 bit) --
-- AVC --
-- h265 / HEVC (8 bit) --
-- VP8 --
-- VC-1 --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 1.0 TB distributed across 4 memory channels. It offers a peak memory bandwidth of 102.4 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
4 Memory channels --
1.0 TB Max. Memory 0 bytes
DDR4-3200 Memory type
Yes AES-NI No
102.4 GB/s Bandwidth --
Yes ECC No
pci PCIe pci
 
 

Thermal Management

The processor has a thermal design power (TDP) of 126 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
126 W TDP (PL1 / PBP) None
-- Tjunction max --
 
 

Technical details

The Intel Xeon D-2779 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Q1/2022 Release date --
Ice Lake Architecture --
Technical data sheet Documents Technical data sheet
VT-x, VT-x EPT, VT-d Virtualization
Monolithic Chip design --
0 bytes L3-Cache 0 bytes
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions
10 nm Technology --
BGA 2579 Socket
x86-64 (64 bit) Instruction set (ISA)
-- Part Number --
1558 $ Release price --
Windows 10, Linux Operating systems
25.0 MB L2-Cache 0 bytes