| Name: | HiSilicon Kirin 910 |
| Family: | |
| Group: | |
| Segment: | -- |
| Generation: | -- |
HiSilicon Kirin 910 Benchmark, Test and specs
Last updated:
CPU lineage
CPU Cores and Base Frequency
| CPU Cores: | -- |
| Threads: | -- |
| Core architecture: | -- |
| Hyperthreading: | No |
| Overclocking: | No |
Memory & PCIe
| Memory type: | |
| Max. Memory: | 0 bytes |
| Memory channels: | -- |
| Bandwidth: | -- |
| ECC: | No |
| PCIe: | pci |
| AES-NI: | No |
Thermal Management
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
| TDP (PL1 / PBP): | None |
| TDP (PL2): | None |
| TDP up: | None |
| TDP down: | None |
| Tjunction max: | -- |
Technical details
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
| Technology: | -- |
| Chip design: | -- |
| Socket: | |
| L2-Cache: | 0 bytes |
| L3-Cache: | 0 bytes |
| Architecture: | -- |
| Operating systems: |
| Virtualization: | |
| Instruction set (ISA): | |
| ISA extensions: | |
| Release date: | -- |
| Release price: | -- |
| Part Number: | -- |
| Documents: | Technical data sheet |
ADS
Benchmarks
iGPU - FP32 Performance (Single-precision GFLOPS)
|
Intel Atom E3825
2C 2T @ 1.33 GHz
|
34
|
|
|
Samsung Exynos 7872
NoneC NoneT @ --
|
32
|
|
|
HiSilicon Kirin 910
NoneC NoneT @ --
|
32
|
|
|
Samsung Exynos 7872
NoneC NoneT @ --
|
32
|
|
|
MediaTek MT8732
NoneC NoneT @ --
|
28
|
