Intel Xeon Silver 4309Y vs Intel Core2 Duo T5750

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon Silver 4309Y or Intel Xeon Silver 4309Y – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon Silver 4309Y features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2021 and belongs to the 3 generation of the Intel Xeon Silver series.
To use the Intel Xeon Silver 4309Y, you'll need a motherboard with a LGA 4189 socket.
The Intel Core2 Duo T5750 features 2 processor cores and has the capability to manage 2 threads concurrently.
It belongs to the 1 generation of the Intel Celeron series.
To use the Intel Core2 Duo T5750, you'll need a motherboard with a PGA 478 socket.
Intel Xeon Silver Family Intel Celeron
Desktop / Server Segment Mobile
3 Generation 1
Intel Xeon Silver 4309Y Name Intel Core2 Duo T5750
Intel Xeon Silver 4300 Group Intel Core 2 Duo T5000
 
 

CPU Cores and Base Frequency

The Intel Xeon Silver 4309Y has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon Silver 4309Y is 2.8 GHz
and turbo frequency for one core is 3.6 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The Intel Core2 Duo T5750 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo T5750 is 2.0 GHz
3.6 GHz Turbo Frequency (1 core) None
8x Cores 2x
16 Threads 2
8 CPU Cores 2
normal Core architecture normal
Yes Hyperthreading No
No Overclocking No
2.8 GHz Frequency 2.0 GHz
 
 

Internal Graphics

The Intel Xeon Silver 4309Y does not have integrated graphics.
The Intel Core2 Duo T5750 does not have integrated graphics.
-- Execution units --
-- Generation --
-- Direct X --
-- Shaders --
0 bytes Max. GPU Memory 0 bytes
-- GPU frequency --
-- Technology --
-- Release date --
-- Max. displays --
-- GPU (Turbo) --
GPU name
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC --
-- VP8 --
-- h265 / HEVC (10 bit) --
-- h264 --
-- h265 / HEVC (8 bit) --
-- VP9 --
-- JPEG --
-- VC-1 --
-- AV1 --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 6.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 170.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
6.0 TB Max. Memory 0 bytes
Yes ECC No
Yes AES-NI No
8 Memory channels --
pci PCIe pci
170.8 GB/s Bandwidth --
DDR4-2666 Memory type
 
 

Thermal Management

The processor has a thermal design power (TDP) of 105 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 35 W watts.
-- Tjunction max 100 °C
105 W TDP (PL1 / PBP) 35 W
 
 

Technical details

The Intel Xeon Silver 4309Y is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 12.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Core2 Duo T5750 is manufactured using a 65 nm process.
12.0 MB L3-Cache 0 bytes
Windows 10, Linux Operating systems
SSE4.2, AVX2, AVX-512 ISA extensions SSE3, MMX, SSE, SSE2
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
536 $ Release price --
Technical data sheet Documents Technical data sheet
Q2/2021 Release date --
0 bytes L2-Cache 2.0 MB
VT-x, VT-x EPT, VT-d Virtualization VT-x
-- Part Number --
Ice Lake Architecture Merom (Core)
10 nm Technology 65 nm
LGA 4189 Socket PGA 478
Monolithic Chip design Monolithic