HiSilicon Kirin 960 Benchmark, Test and specs

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CPU lineage

The HiSilicon Kirin 960 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2016 and belongs to the 5 generation of the HiSilicon Kirin series.
Name: HiSilicon Kirin 960
Family: HiSilicon Kirin
Group: HiSilicon Kirin 960
Segment: Mobile
Generation: 5

CPU Cores and Base Frequency

The HiSilicon Kirin 960 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 2.4 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
CPU Cores: 8
Threads: 8
Cores A: 4x Cortex-A73
Cores B: 4x Cortex-A53
Core architecture: hybrid (big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 2.4 GHz
B-Core Frequency: 1.8 GHz

Internal Graphics

The HiSilicon Kirin 960 has integrated graphics, called iGPU for short. Specifically, the HiSilicon Kirin 960 uses the ARM Mali-G71 MP8, which has 256 texture shaders and 8 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-G71 MP8
GPU frequency: 0.9 GHz
GPU (Turbo): --
Execution units: 8
Shaders: 256
Max. GPU Memory: 2.0 GB
Max. displays: --
Generation: Bifrost 1
Direct X: 11
Technology: 16 nm
Release date: Q2/2016

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode
h264: Decode / Encode
VP8: Decode / Encode
VP9: No
AV1: No
AVC: Decode / Encode
VC-1: No
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR4-1600
Max. Memory: 6.0 GB
Memory channels: 2
Bandwidth: --
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

The processor has a thermal design power (TDP) of 5 W watts. TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): 5 W
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The HiSilicon Kirin 960 is manufactured using a 16 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 4.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 16 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 4.0 MB
Architecture: Cortex-A73 / Cortex-A53
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv8-A64 (64 bit)
ISA extensions:
Release date: Q4/2016
Release price: --
Part Number: --
Documents: Technical data sheet
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Benchmarks

Geekbench 5, 64bit (Multi-Core)

Intel Core i5-3340M
2C 4T @ 2.7 GHz
1497
1497
AMD Phenom II X4 970
4C 4T @ 3.5 GHz
1491
1491
HiSilicon Kirin 960
8C 8T @ 2.4 GHz
1491
1491
AMD Phenom II X4 970
4C 4T @ 3.5 GHz
1491
1491
Intel Celeron G4900
2C 2T @ 3.1 GHz
1484
1484

Geekbench 5, 64bit (Single-Core)

AMD Athlon II X2 245e
2C 2T @ 2.9 GHz
382
382
Intel Atom C3758R
8C 8T @ 2.4 GHz
381
381
HiSilicon Kirin 960
8C 8T @ 2.4 GHz
381
381
Intel Atom C3758R
8C 8T @ 2.4 GHz
381
381
Intel Celeron 1005M
2C 2T @ 1.9 GHz
380
380

iGPU - FP32 Performance (Single-precision GFLOPS)

AMD A6-5400K
2C 2T @ 3.6 GHz
246
246
AMD A6-5400B
2C 2T @ 3.6 GHz
246
246
HiSilicon Kirin 960
8C 8T @ 2.4 GHz
245
245
Intel Core i5-3610ME
2C 4T @ 2.7 GHz
243
243
AMD A4-9120C
2C 2T @ 1.6 GHz
230
230