HiSilicon Kirin 960 vs Intel Celeron E1400

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 960 or HiSilicon Kirin 960 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 960 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2016 and belongs to the 5 generation of the HiSilicon Kirin series.
The Intel Celeron E1400 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q2/2008 and belongs to the 1 generation of the Intel Celeron series.
To use the Intel Celeron E1400, you'll need a motherboard with a LGA 775 socket.
HiSilicon Kirin Family Intel Celeron
Mobile Segment Desktop / Server
HiSilicon Kirin 960 Group Intel Celeron E1000
5 Generation 1
HiSilicon Kirin 960 Name Intel Celeron E1400
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 960 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Intel Celeron E1400 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Celeron E1400 is 2.0 GHz
hybrid (big.LITTLE) Core architecture normal
8 CPU Cores 2
No Overclocking No
4x Cortex-A53 Cores B None
No Hyperthreading No
4x Cortex-A73 Cores A None
2.4 GHz A-Core Frequency None
1.8 GHz B-Core Frequency None
None None 2x Core
None None 2.0 GHz
8 Threads 2
 
 

Internal Graphics

The HiSilicon Kirin 960 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 960 uses the ARM Mali-G71 MP8, which has 256 texture shaders
and 8 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Celeron E1400 does not have integrated graphics.
11 Direct X --
Q2/2016 Release date --
Bifrost 1 Generation --
2.0 GB Max. GPU Memory 0 bytes
-- Max. displays --
8 Execution units --
256 Shaders --
-- GPU (Turbo) --
16 nm Technology --
0.9 GHz GPU frequency --
ARM Mali-G71 MP8 GPU name
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
No VC-1 --
Decode h265 / HEVC (10 bit) --
Decode / Encode h265 / HEVC (8 bit) --
No VP9 --
No AV1 --
Decode / Encode AVC --
Decode / Encode JPEG --
Decode / Encode VP8 --
Decode / Encode h264 --
 
 

Memory & PCIe

pci PCIe pci
No AES-NI No
LPDDR4-1600 Memory type DDR3-1066, DDR2-800
No ECC No
2 Memory channels 2
6.0 GB Max. Memory 16.0 GB
-- Bandwidth --
 
 

Thermal Management

The processor has a thermal design power (TDP) of 5 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 65 W watts.
-- Tjunction max --
5 W TDP (PL1 / PBP) 65 W
 
 

Technical details

The HiSilicon Kirin 960 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 4.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Celeron E1400 is manufactured using a 65 nm process.
-- Release price --
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
0 bytes L2-Cache 512.0 KB
Q4/2016 Release date Q2/2008
Cortex-A73 / Cortex-A53 Architecture Conroe (Core)
Socket LGA 775
Android Operating systems Windows 10, Linux
Technical data sheet Documents Technical data sheet
-- Part Number --
None Virtualization None
Chiplet Chip design Monolithic
ISA extensions SSE3, MMX, SSE, SSE2
16 nm Technology 65 nm
4.0 MB L3-Cache 0 bytes