HiSilicon Kirin 710 vs HiSilicon Kirin 810

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 710 or HiSilicon Kirin 710 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 710 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2018 and belongs to the 5 generation of the HiSilicon Kirin series.
The HiSilicon Kirin 810 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2019 and belongs to the 6 generation of the HiSilicon Kirin series.
HiSilicon Kirin 710 Group HiSilicon Kirin 810/820
5 Generation 6
HiSilicon Kirin 710 Name HiSilicon Kirin 810
Mobile Segment Mobile
HiSilicon Kirin Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 710 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel.
1.7 GHz B-Core Frequency 1.9 GHz
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
4x Cortex-A73 Cores A 2x Cortex-A76
8 CPU Cores 8
No Overclocking No
No Hyperthreading No
2.2 GHz A-Core Frequency 2.2 GHz
4x Cortex-A53 Cores B 6x Cortex-A55
8 Threads 8
 
 

Internal Graphics

The HiSilicon Kirin 710 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 710 uses the ARM Mali-G51 MP4, which has 128 texture shaders
and 8 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 810 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 810 uses the ARM Mali-G52 MP6, which has 288 texture shaders
and 16 execution units.
1.0 GHz GPU (Turbo) --
12 nm Technology 12 nm
11 Direct X 12
4.0 GB Max. GPU Memory 4.0 GB
8 Execution units 16
Q2/2018 Release date Q1/2018
ARM Mali-G51 MP4 GPU name ARM Mali-G52 MP6
128 Shaders 288
0.65 GHz GPU frequency 0.85 GHz
Bifrost 1 Generation Bifrost 2
-- Max. displays --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode / Encode VP9 Decode / Encode
Decode / Encode VP8 Decode / Encode
Decode / Encode VC-1 Decode / Encode
Decode / Encode JPEG Decode / Encode
Decode / Encode h264 Decode / Encode
No h265 / HEVC (10 bit) Decode / Encode
Decode / Encode AVC Decode / Encode
No AV1 No
 
 

Memory & PCIe

LPDDR3, LPDDR4 Memory type LPDDR4X-2133
-- Bandwidth --
No AES-NI No
No ECC No
pci PCIe pci
6.0 GB Max. Memory 6.0 GB
2 Memory channels 4
 
 

Thermal Management

The processor has a thermal design power (TDP) of 5 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
5 W TDP (PL1 / PBP) 5 W
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 710 is manufactured using a 12 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 1.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 810 is manufactured using a 7 nm process.
None Virtualization None
12 nm Technology 7 nm
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
ISA extensions
-- Part Number --
Chiplet Chip design Chiplet
Q3/2018 Release date Q2/2019
-- Release price --
0 bytes L2-Cache 0 bytes
Technical data sheet Documents Technical data sheet
1.0 MB L3-Cache 1.0 MB
Socket
Android Operating systems Android
Cortex-A73 / Cortex-A53 Architecture Cortex-A76 / Cortex-A55
 
 

Benchmarks

AnTuTu 9 Benchmark

HiSilicon Kirin 810
8C 8T @ 2.2 GHz
338464
338464
HiSilicon Kirin 710
8C 8T @ 2.2 GHz
224605
224605

AnTuTu 8 Benchmark

HiSilicon Kirin 810
8C 8T @ 2.2 GHz
301946
301946
HiSilicon Kirin 710
8C 8T @ 2.2 GHz
196747
196747

Geekbench 6 (Multi-Core)

HiSilicon Kirin 810
8C 8T @ 2.2 GHz
2035
2035
HiSilicon Kirin 710
8C 8T @ 2.2 GHz
1206
1206

Geekbench 5, 64bit (Multi-Core)

HiSilicon Kirin 810
8C 8T @ 2.2 GHz
1898
1898
HiSilicon Kirin 710
8C 8T @ 2.2 GHz
1384
1384

Geekbench 6 (Single-Core)

HiSilicon Kirin 810
8C 8T @ 2.2 GHz
772
772
HiSilicon Kirin 710
8C 8T @ 2.2 GHz
348
348