Qualcomm Snapdragon 845 vs Intel Pentium T2390

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 845 or Qualcomm Snapdragon 845 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 845 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2018 and belongs to the 5 generation of the Qualcomm Snapdragon series.
The Intel Pentium T2390 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q1/2008 and belongs to the 1 generation of the Intel Pentium series.
To use the Intel Pentium T2390, you'll need a motherboard with a PGA 478 socket.
Mobile Segment Mobile
Qualcomm Snapdragon 845 Name Intel Pentium T2390
Qualcomm Snapdragon Family Intel Pentium
5 Generation 1
Qualcomm Snapdragon 845/850 Group Intel Pentium T2000/T3000
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 845 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.8 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Intel Pentium T2390 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Pentium T2390 is 1.86 GHz
1.8 GHz B-Core Frequency None
2.8 GHz A-Core Frequency None
4x Kryo 385 Silver Cores B None
4x Kryo 385 Gold Cores A None
No Overclocking No
hybrid (big.LITTLE) Core architecture normal
None None 1.86 GHz
8 Threads 2
No Hyperthreading No
8 CPU Cores 2
None None 2x Core
 
 

Internal Graphics

The Qualcomm Snapdragon 845 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 845 uses the Qualcomm Adreno 630, which has 256 texture shaders
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Pentium T2390 does not have integrated graphics.
0.7 GHz GPU frequency --
Q1/2018 Release date --
11 Direct X --
Qualcomm Adreno 630 GPU name
10 nm Technology --
-- Max. displays --
256 Shaders --
8.0 GB Max. GPU Memory 0 bytes
-- Execution units --
4 Generation --
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode AVC --
Decode VC-1 --
Decode VP9 --
Decode h265 / HEVC (10 bit) --
Decode / Encode h264 --
Decode VP8 --
Decode h265 / HEVC (8 bit) --
Decode / Encode JPEG --
No AV1 --
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 10.0 GB distributed across 4 memory channels. It offers a peak memory bandwidth of 52.0 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
4 Memory channels 2
10.0 GB Max. Memory 8.0 GB
pci PCIe pci
No AES-NI No
No ECC No
52.0 GB/s Bandwidth --
LPDDR4X-3733 Memory type DDR2-800
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 35 W watts.
-- Tjunction max 100 °C
None TDP (PL1 / PBP) 35 W
 
 

Technical details

The Qualcomm Snapdragon 845 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Pentium T2390 is manufactured using a 65 nm process.
Q1/2018 Release date Q1/2008
SDM845 Part Number --
1.5 MB L2-Cache 1.0 MB
None Virtualization VT-x
ISA extensions SSE3, MMX, SSE, SSE2
Chiplet Chip design Monolithic
Kryo 385 Architecture Merom (Core)
10 nm Technology 65 nm
Socket PGA 478
Android Operating systems Windows 10, Linux
-- Release price --
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
2.0 MB L3-Cache 0 bytes