HiSilicon Kirin 810 vs HiSilicon Kirin 970

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CPU comparison with benchmarks

-VS-

CPU lineage

HiSilicon Kirin 810 or HiSilicon Kirin 810 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 810 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2019 and belongs to the 6 generation of the HiSilicon Kirin series.
The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.
HiSilicon Kirin 810/820 Group HiSilicon Kirin 970
6 Generation 6
Mobile Segment Mobile
HiSilicon Kirin 810 Name HiSilicon Kirin 970
HiSilicon Kirin Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
8 Threads 8
1.9 GHz B-Core Frequency 1.84 GHz
8 CPU Cores 8
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
2x Cortex-A76 Cores A 4x Cortex-A73
No Hyperthreading No
2.2 GHz A-Core Frequency 2.4 GHz
No Overclocking No
6x Cortex-A55 Cores B 4x Cortex-A53
 
 

Internal Graphics

The HiSilicon Kirin 810 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 810 uses the ARM Mali-G52 MP6, which has 288 texture shaders
and 16 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 970 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders
and 12 execution units.
288 Shaders 192
Q1/2018 Release date Q3/2017
12 nm Technology 16 nm
12 Direct X 12
4.0 GB Max. GPU Memory 2.0 GB
-- Max. displays --
16 Execution units 12
0.85 GHz GPU frequency 0.75 GHz
Bifrost 2 Generation Bifrost 2
-- GPU (Turbo) --
ARM Mali-G52 MP6 GPU name ARM Mali-G72 MP12
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode VP8 Decode / Encode
Decode / Encode VC-1 Decode / Encode
Decode / Encode JPEG Decode / Encode
No AV1 No
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode / Encode AVC Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode VP9 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
 
 

Memory & PCIe

pci PCIe pci
No AES-NI No
LPDDR4X-2133 Memory type LPDDR4X-2133
No ECC No
6.0 GB Max. Memory 8.0 GB
4 Memory channels 4
-- Bandwidth --
 
 

Thermal Management

The processor has a thermal design power (TDP) of 5 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 9 W watts.
5 W TDP (PL1 / PBP) 9 W
-- Tjunction max --
 
 

Technical details

The HiSilicon Kirin 810 is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 1.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 970 is manufactured using a 10 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q2/2019 Release date Q3/2017
None Virtualization None
ISA extensions
7 nm Technology 10 nm
Chiplet Chip design Chiplet
-- Release price --
Cortex-A76 / Cortex-A55 Architecture Cortex-A73 / Cortex-A53
1.0 MB L3-Cache 2.0 MB
Android Operating systems Android
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
-- Part Number --
Socket
0 bytes L2-Cache 0 bytes